top of page

Tapes Manufacturing

  • Production Process Flow​​

    • Tapes Production Process​

Measurement of Adhesive
Weight/Viscosity and Mixing

Materials Preperation

Picture.png
Picture1.png

Adhesive Coating on Base Film

Picture 2.png
Picture 6.png
Picture 7.png
Picture 9.png
Picture 3.png

Drying in Oven

Release Linear Input and Lamination

Winding

Slitting

Packing and Shipping

Picture 5.png
Picture 4.png

Our Expertise on Tapes

  • Established Tapes Specialist addressing Semiconductor, Display and Mobile Market

  • Long Years of Experiences and Technical Expertise on Tapes Manufacturing​

  • Proven Quality and Performance by Global Leading Companies

  • Strong R&D Capability pursuing Innovative Technology Development

  • Qualified Supply Chains enabling Cost-Competitiveness and Industry-Leading Quality

  • Ready for Market’s New Demand and provide Solutions for Customer’s Troubles

Picture.png
Picture1.png
Picture2.png

Our Tapes for Semiconductor

  • QFN Backside Tapes

​

  • Package Dicing Tapes

​

  • Sputter Tapes for EMI Shielding

​

  • Wafer Dicing Tape

Picture.png

QFN Backside Tape

  • Applications

    • Utilized to ensure Stable Molding Process of Metal Lead Frame (Cu-L/F, Ni-Pd L/F) packages

    • Shall provide Thermal Stability during Molding Process and prevent Outgassing/Mold Flash

Strip of Lead Frame

Tape Detach

Picture1.png

One unit in Lead Frame

Picture2.png

Pad

Leads

Pad 

Lead Frame

Leads

Pre-Tape Process

Picture5.png

​Tape Lamination

PI Tape

Picture6.png

EMC (Epoxy Mold Compound)

Picture3.png

Molding

Picture5.png
Picture2.png

Chip Attach

Pad 

Lead Frame

Leads

Si Chip

Picture7.png

Chip Attach

Picture4.png

Tape Detach

Picture3.png

Bonded Wire

Wire Bonding

Bonded Wire

Picture8.png

Wire Bonding

Picture-removebg-preview.png
Picture.png

​Tape Lamination

Picture8.png

PI Tape

Si Chip

Post-Tape Process

  • Features

    • High Thermal Stability during Molding Process

    • No Mold Flash and Low Outgassing

    • Excellent Processing and Workability without Residue

    • High Modulus property enables Stable Wire Bonding on Pre-Tapes

    • Primary Customers: ASE, AMKOR

Picture.png
Picture5-removebg-preview.png

PI Film (25um)

Adhesive Layer (1~12um)

PET Liner (50um)

Picture1.png

  • Products​

Item

Unit

MPI2510

MPI2505

ELQ2505A

ELQ2505C

ELQ2510B

ELQ2505AH

ELQ2510AH

Total Thickness

um

85

80

80

80

85

80

85

PI Film/ Adhesive

um

25/10

25/5

25/5

25/5

25/10

25/5

25/10

PET Liner

um

50

50

50

50

50

50

50

Adhesion Strength

@200℃(1hr)

-

-

-

-

-

-

180

Type

Post Tape

Pre/Post

Post Tape

Pre/Post Tape

@RT

400

300

140

380

175

380

130

@175℃(30sec)

380

250

100

340

100

-

-

@175℃(30min)
→@RT(30min)

450

380

190

430

270

-

-

@200℃(1hr)
→@RT(30min)

550

400

350

460

400

-

-

@220℃(1hr)

-

-

-

-

-

180

-

UV Curable Package Dicing Tape

  • Applications

    • Strongly holds packages during dicing process and enables easy pick-up of separated packages after UV irradiation

    • Applicable to BGA, CSP, QFN and other package types

    • AMKOR, ASE, Hana Micron

Picture.png
Picture1.png

  • Features

    • Strong adhesion to prevent any movement or flying of packages during package dicing process

    • After UV illumination, adhesion strength is minimized enabling easy pick-up of packageswithout leaving residue or contamination

Get to Know Us

Package Dicing Tape _ EO-PU170

  • Tape Structure

  • Specifications

Picture6.png

PET Release Liner

UV-Curable Acrylic PSA

Polyolefin Film

  • Strong Adhesion with Packages

  • ​Low Adhesion after UV Irradiation

  • No Residue after Tapes Removal

Properties

Unit

Specifications

Total Thickness

mm

0.17 +/- 0.012

(Excluding Release Liner)

Base Film Thickness

mm

0.15 +/- 0.01

Adhesive

mm

0.02 +/- 0.002

180Ëš Peel Strength

(Adhesive Strength)

Before UV          1300

gf/inch

SUS

After UV        20 +/- 10

Tensile Strength

kgf/cm2

MD                  278

TD                   235

Elongation

%

MD                  920

TD                   842

  • UV Irradiation Conditions

    • UV Intensity 400mW/cm2, UV Dosage 400mJ/cm2, Wave Length ~365nm

    • By Mercury Lamp

Package Dicing Tape _ ELD-108

  • Tape Structure

  • Specifications

Picture6.png

PET Release Liner

UV-Curable Acrylic PSA

Polyolefin Film

  • Strong Adhesion with Packages

  • ​Low Adhesion after UV Irradiation

  • No Residue after Tapes Removal

Properties

Unit

Specifications

Total Thickness

mm

0.108 +/- 0.012

(Excluding Release Liner)

Base Film Thickness

mm

0.1 +/- 0.01

Adhesive

mm

0.008 +/- 0.002

180Ëš Peel Strength

(Adhesive Strength)

Before UV         >1200

gf/inch

SUS

After UV        20 +/- 10

Tensile Strength

kgf/cm2

Elongation

%

MD                  280

TD                   258

MD                  715

TD                   730

  • UV Irradiation Conditions

    • UV Intensity 400mW/cm2, UV Dosage 400mJ/cm2, Wave Length ~365nm

    • By Mercury Lamp

Package Dicing Tape _ ELD-170PE

  • Tape Structure

  • Specifications

Picture6.png

PET Release Liner

UV-Curable Acrylic PSA

Polyolefin Film

Total Thickness

mm

0.23 +/- 0.012

(Excluding Release Liner)

Properties

Unit

Specifications

Base Film Thickness

mm

0.21 +/- 0.01

Adhesive

mm

0.02 +/- 0.002

180Ëš Peel Strength

(Adhesive Strength)

Before UV         >1200

gf/inch

SUS

After UV        20 +/- 10

  • Strong Adhesion with Packages

  • ​Low Adhesion after UV Irradiation

  • No Residue after Tapes Removal

Tensile Strength

kgf/cm2

MD                  261

TD                   217

Elongation

%

MD                  850

TD                   800

  • UV Irradiation Conditions

    • UV Intensity 400mW/cm2, UV Dosage 400mJ/cm2, Wave Length ~365nm

    • By Mercury Lamp

Sputtering Tape for EMI Shielding

  • Applications

    • Holds packages temporarily during sputtering process for deposition of EMI Shielding layers

    • Applicable to LGA, BGA Packages

    • Primary Customers: AMKOR, ASE

  • Features

    • Thermal Resistance up to 400℃

    • Low Outgassing/Hume

    • Maintaining Strong Adhesion @ > 200℃

    • No Residue after > 200℃/2hr

Picture1.png

  • Tape Structure

    • Polyimide Film: 12.5, 50, 75㎛

    • Special Si Adhesive: 5~60㎛

    • Release Liner: 50㎛

Picture.png

LGA Type Process-HSF017C

Substrate Mount

On 17.5㎛ Sputtering Tape

Picture8.png
Picture9.png

PkG Sawing

Picture10.png

Elastomer

Mount

Picture7-removebg-preview.png

PKG Mold Cap

Substrate

Sputtering Tape (17.5㎛)

Elastomer

Picture11.png
Picture12.png

PKG Mount

On

Elastomer

Sputtering

2 Frames

On Career

LGA Type Process-HSF017C, HSF070F, HSF095G

Substrate Mount

On 17.5㎛ Sputtering Tape

Picture8.png
Picture9.png

PkG Sawing

Picture13.png

PKG Mold Cap

Substrate

Sputtering Tape (17.5㎛)

Sputtering Tape(70㎛, 95㎛)

Picture14.png
Picture15.png
Picture16.png

95㎛ Sputtering Tape Mount

PKG Mount

On

Sputtering Tape

Sputtering

2 Frames

On Career

BGA Type Process-HSF095G

Picture17.png

PKG Mold Cap

Substrate

Sputtering Tape (95㎛)

Picture18.png
Picture19.png
Picture20.png

95㎛

Sputtering Tape

Mount

PKG

Pocket

Trench by Laser

PKG Mount

On Trenched

Pocket

Picture21.png

Sputtering

4 Frames

On Career

BGA Type Process-HSF095G, ESF135K
ESF150, ESF335(New development)

Substrate Mount

On 150/335㎛ UV Tape

Picture22.png

PKG Mold Cap

Substrate

Sputtering UV Tape (150㎛, 335㎛)

  • New Development

Sputtering Tape (095㎛,135㎛)

Picture23.png
Picture25.png
Picture26.png
Picture27.png
Picture28.png

PkG Sawing

95㎛ Sputtering Tape Mount

PKG Mount

On

Sputtering Tape

Sputtering

2 Frames

On Career

UV curable Tape for BGA PKC

Picture29.png

ESF150

PET Film (0.025㎜)

Adhesive (0.125㎜)

Release liner (0.05㎜)

Picture29.png

PET Film (0.125㎜)

Adhesive (0.210㎜)

ESF335

Release liner (0.05㎜)

Picture30.png
Picture31.png

  • Specifications

Item

Unit

ESF150

ESF335

Total

Thickness

Film

Adhesive

Release Liner

mm

mm

mm

mm

0.15

0.335

0.025

0.125

0.125

0.05

0.210

0.05

Adhesion on Sus before UV

gf/25mm

320

900

Adhesion on Sus after UV

gf/25mm

4

5

  • UV Irradiation Conditions

    • UVray intensity: 230㎽/㎠

    • UVray dosage:200ㄹmJ/㎠

    • Wavelengthof ultravioletshould bearound365㎚

  • Good Lamination (Good Ball dipping, Min. void)

  • Good sawing ability

  • Easy PKG pick-up

  • No Residue

Sputtering Tape for EMI Shielding

  • Products Models​

Item

Unit

ESF017C

SV022ES

HSF045D

ESF070C

ESF070F

ESF095G

SVP095ES

ESF135K

Total

 Thickness

Base film

Adhesive

mm

mm

mm

0.017

0.0125

0.005

0.022

0.0125

0.01

0.045

0.025

0.02

0.07

0.05

0.02

0.07

0.05

0.02

0.095

0.075

0.02

0.095

0.075

0.02

0.135

0.075

0.06

Adhesion

SUS

gf/25mm

300

310

400

350

600

700

1200

1200

Tensile Strength

MD

TD

MPa

MPa

323

325

323

325

279

283

269

270

269

270

272

281

198

232

274

271

Elongation

MD

TD

%

%

71

74

71

74

81

83

72

77

72

77

84

89

195

124

84

82

Adhesive Residue

80%×240hr

-

60℃×90%× 240hr

-

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

UV/Non-UV Wafer Dicing Tape

  • Products Models​

Item

Unit

Non UV Dicing

UV Dicing

EO-DA110

EO-DA085

ET-RE090

EO-DA090

EO-BG170

EP-DB090

EP-DW090

ET-DC125

Type

-

PO

PO

PET

PO

PO

PVC(blue)

PVC(white)

PET

Base Film

Thickness

um

80

80

50

80

150

80

80

100

Adhesive

Thickness

um

30

5

40

10

20

10

10

25

Young's Modulus (MD)

kgf/cm2

550

550

-

550

900

1200

1200

-

Tensile Strength (MD)

gf

1200

1200

-

1200

2100

1900

1900

-

Elongation (MD)

%

300

300

-

300

400

200

200

-

Peeling Force (BF UV)

gf/inch

40-60

20-30

1500-2000

50-150

1500-2000

200-300

200-300

1500-2000

Peeling Force (AF UV)

gf/inch

-

-

-

20

30

30

30

10

Picture32.png

Get to Know Us

Detach System for LF Backside Tape

Leadframe Backside Tape Detach System

  • Fully Automated LF Backside Tape Detach

  • Available for various LF size

  • Flexible loading/Unloading magazine method

  • Elaborate gripper handling

Picture1.png

  • No tape-tearing through main arm’s handling

  • No LF jamming / Broken

Dimension

X (m) : 2.7

Y (m) : 1.6

Z (m) : 2.0

W (t) : 1.6

Picture2.png

Detach System for LF Backside Tape

  • Traditional Manual Detach Method

  • Detach by Automated System

Peeling Tape edge by Tweezer

Detach Tape by Manual tooling

Picture5.png
Picture3.png
Picture4.png
Picture6.png
Picture7.png

Peeling Tape edge by Gripper

Detach Tape by Auto handler

Picture8.png

Wafer Frame Cleaning System

Wafer Ring Cleaning System of Fully Automated skeleton wafer recovery Machine

  • Fully Automated skeleton wafer recovery system

  • Installed Bar code reader

  • Comparison skeleton wafer vs Map file

  • Sorting warpaged wafer frame

Picture9.png

  • Cleaning tape residue on wafer frame

  • Insert slip paper and folding skeleton wafer function

  • Extremely little operation and Maintenance cost

  • Cleaning wafer frame cassette

  • Implement only the functions that customer wants

Dimension

X (m) : 3.2

Y (m) : 2.0

Z (m) : 2.0

Wafer Frame Cleaning System

Each Module Function

Picture12.png
Picture10.png

2. Wafer Frame Carrier Cleaning

3. Wafer Frame Carrier Loader

4.Wafer Barcode Scan & Folding

5. Wafer Frame Cleaning

6. Wafer Frame Unloader

7. Wafer Slip- sheet Loader

Some customer need this function only

Full Auto System

1. Die Recovery

Wafer Frame Cleaning System

  • Traditional Manual Method

  • Remove ring and wafer by manual

Picture.png

  • Gather skeleton wafers

Picture2.png

  • Cleaning wafer frame by manual

Picture3.png
Picture14.png
Picture15.png
Picture16.png
Picture17.png
Picture18.png

Wafer Frame Cleaning System

Wafer Frame Cleaning only (Type1- Normal)

  • Cleaning tape residue on wafer frame

  • Extremely little operation and Maintenance cost ( No use chemical)

  • Frame Top / Bottom two side cleaning at the same time

  • For 12” frame size : K- WBG Line

Picture19.png

  • For 8” & 12” multi (Auto conversion – No need set up time) : K- DPS Line

  • Automatic sprinkler system

  • Double frame loading detection function

  • Equipped the scrapper for cleaning serious residue

  • UPH : Min 100pcs

Dimension

X (m) : 1.8

Y (m) : 1.5

Z (m) : 2.1

Picture20.png

Ring Frame Loader

Cleaning

Ring Frame Unloader

Wafer Frame Cleaning System

Wafer Frame Cleaning only (Type2- Cart docking)

  • Cleaning tape residue on wafer frame

  • Extremely little operation and Maintenance cost ( No use chemical)

  • Frame Top / Bottom two side cleaning at the same time

  • Use the Cart for Loading/ Unloading ring frame

Picture21.png

  • For 8” & 12” multi (Auto conversion – No need set up time) : K- F-Line

  • Automatic sprinkler system

  • Double frame loading detection function

  • Equipped the scrapper for cleaning serious residue

  • UPH : Min 100pcs

Dimension

X (m) : 2.6

Y (m) : 1.4

Z (m) : 2.1

Picture22.png

Unit Separate System

Full Auto PKG Separation Machine

  • Automation Unit separator

  • For various package size, especially small body (under 3x3mm)

  • Loading/ Un-Loading

  • 8ea tray can be loaded on the turn table

Picture23.png

  • Developed the special Separation Tool

  • Vision inspection for remained unit on Tape

  • Communication function between Main server

  • Barcode system

Dimension

X (m) : 2.0

Y (m) : 1.7

Z (m) : 1.7

Picture24.png

Inspection System

Strip inspection Equipment Feature

  • Fully Automated System

  • High Vision Performance (Adopting Keyence camera)

  • Line Scanner Type (Dual camera, Auto focusing)

  • Strip Top/Bottom inspection with Flip Over function

Picture25.png

  • Advanced UPH by Dual inspection stage(Turn Table)

  • Easy Data MAP communication (FTP)

  • Compact Machine size with lots of function

  • Better monitoring with 4 Display

Dimension

X(m) : 2.9

Y (m) : 1.5

Z (m) : 2.0

Valued Customers

Picture26.png
bottom of page